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Technology

VSMC opens first 300mm chip fab in Singapore, targets volume output in early 2027

The Vanguard–NXP joint venture's first 12-inch fab in Tampines has entered risk production after 22 months of construction, with volume output planned for the first quarter of 2027.

By Priya Raman · · 1 min read

VisionPower Semiconductor Manufacturing Company (VSMC) has formally opened its first 12-inch (300mm) chip fabrication plant in Tampines, Singapore, marking the facility’s entry into risk production ahead of planned volume output in the first quarter of 2027.

VSMC is a joint venture established in September 2024 by Vanguard International Semiconductor (VIS) and NXP Semiconductors. Construction began with a groundbreaking ceremony in December 2024; after 22 months, the fab has processed its first sample lot at yields above 99 per cent, the company said.

The fab will run process technologies from 130nm to 40nm for mixed-signal, power management, analogue and interposer applications, serving high-performance computing, mobile, automotive, industrial and consumer markets. At full capacity by 2029 it is expected to produce about 44,000 12-inch wafers a month and create around 1,600 jobs.

VSMC chairman Leuh Fang said the opening reflected VIS’s long-term commitment to Singapore, while NXP chief executive Rafael Sotomayor said the fab strengthens the company’s “geographic resilience, supply control, and cost competitiveness”. Singapore’s Economic Development Board said the project showed continued global confidence in Singapore as a node for advanced manufacturing.

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